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High-Precision Packaging Service
Welcome to PAKPIC, where precision meets innovation in high-precision packaging solutions tailored for commercial applications. In alignment with Moore’s Law and the principles of ‘More than Moore,’ our services push the boundaries of technology to deliver advanced fibre array attachment processes, featuring both lidded and lidless options with varying channel configurations to meet diverse needs.
With meticulous attention to detail in mechanical package design, we ensure optimal performance across systems, including SOI, SiN, and InP.
Our commitment to quality is underscored by our ability to support volume production, providing essential components and manufacturing capabilities for both low and high-speed applications.
Discover how PAKPIC can elevate your packaging requirements with unmatched accuracy, reliability, and scalability.
PakPIC Services
Fibre Array Attach Process
- Lidded and lidless fibre arrays
- 8, 12, 16 channel fibre arrays (32-channel by request)
- 127 µm or 250 µm pitch
- UHNA (3 μm SSCs) or SSMF (6–10 μm SSCs)
- Electrical DC and FR connections supported
Mechanical Mounting
- Silver epoxy or thermally conductive epoxy bond
- Pick and place or manual, depending on complexity
Flip-Chip Bonding (Low Volume)
- <1 µm placement accuracy
- Reflow at controlled ramp rates
- Mechanical Package Design and Fabrication
- Foundry-agnostic packaging of SOI, SiN, and InP systems
- Standard designs available for rapid-turnaround services
- High-precision wire bonding
Design Consultancy
- PIC design/layout for packaging (subject to design rules)
- Packaging feasibility study
- Bespoke mechanical packages
- Design for vacuum
- Radiation hardness by design
Supply-Chain Support
- Fibre arrays
- Electronic components such as TECs, thermistors, etc.
- PCB manufacturing for low and high-speed applications
